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Residual Stresses III: Science and technology two volume set

Designer: book-specialty-store

$1,858.26

This volume consists of papers presented at the Third International Conference on Residual Stresses held in Tokushima, Japan, 23-26 July 1991.
This book contains the proceedings of the Third International Conference on Residual Stresses, ICRS 3, held in Tokushima, Japan on 23-26 July 1991. Approximately 330 participants from 26 countries discussed resudual stresses on various aspects and 249 papers were presented.
This series of conferences has gained an international reputation as one which deals with all angles of residual and internal stresses. The conference also commemorated the 40th anniversary of the Society of Materials Science, Japan. The range of materials at the conference covered eleven organized sessions.
Residual stresses have been known for a long time, but it is still highly researched in the engineering field because new problems challenge us every year. Problems arise not only in traditional materials for machinery, but also in new materials such as advanced composites and biomaterials. No matter how or what kind of materials we process, residual stresses always exist in products. Their reliability depends on residual stresses, and because new materials are continuously being developed, residual stresses will continue to challenge us.
The papers presented at the conference include all aspects of internal and residual stresses in composites ceramics, thin films and other advanced materials. Modelling and measurement of residual stresses with engineering utilization of residual stresses, are comprehensively treated. Important features are: recent experimental methods to measure residual stresses; theoretical and computational methods to evaluate residual stresses and data base for residual stresses in modern technology.
This book will be of value and interest to scientists and engineers, especially designers and process-engineers working in the fields related to residual and internat stresses.

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